发明名称 |
Light emitting device, and method for manufacturing circuit board |
摘要 |
A light emitting device comprises a light emitting element and a package constituted by a molded article and a first lead and a second lead embedded in the molded article, and having a bottom face, a top face disposed opposite to the bottom face, and a light emission face connected to the bottom face and the top face. The first lead has a first terminal part exposed at the bottom face exposed at the top face. The exposed part is provided more toward the center of the package than the first terminal part. |
申请公布号 |
US8853933(B2) |
申请公布日期 |
2014.10.07 |
申请号 |
US201113291841 |
申请日期 |
2011.11.08 |
申请人 |
Nichia Corporation |
发明人 |
Yamashita Ryohei;Miki Tomohide;Tamaki Hiroto |
分类号 |
H01L33/48;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
Global IP Counselors, LLP |
代理人 |
Global IP Counselors, LLP |
主权项 |
1. A light emitting device comprising:
a light emitting element; a package constituted by a molded article and at least a first lead and a second lead embedded in the molded article, and having a bottom face, a top face disposed opposite to the bottom face, and a light emission face connected to the bottom face and the top face, the first lead including a first terminal part exposed at the bottom face, and an exposed part exposed at the top face, the exposed part being provided more toward the center of the package than the first terminal part, and a bottom face of the first terminal part being continuously flush with the bottom face of the package. |
地址 |
Anan-shi JP |