发明名称 Surface-treated copper foil, method for producing same, and copper clad laminated board
摘要 Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.
申请公布号 US8852754(B2) 申请公布日期 2014.10.07
申请号 US201113574478 申请日期 2011.01.21
申请人 Furukawa Electric Co., Ltd. 发明人 Fujisawa Satoshi;Uno Takeo;Hattori Koichi
分类号 B32B15/20;C25D3/56;C22C19/00;B32B15/01;C25D5/48;B32B15/08;C22C19/03;C25D5/34;H05K3/38 主分类号 B32B15/20
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A surface-treated copper foil, wherein at least one surface of the surface-treated copper foil is obtained by a process comprising roughening an untreated base copper foil, thereby obtaining a roughened surface having a surface roughness Rz of 1.1 μm or less, and applying an Ni—Zn alloy layer to the roughened surface, the roughened surface comprises sharp-pointed convexes, which have a width of from 0.3 to 0.8 μm, a height of from 0.6 to 1.8 μm, and an aspect ratio of from 1.2 to 2.2, the roughening increases the surface roughness by from 0.05 to 0.3 μm, the Ni—Zn alloy layer has a content of from 6 to 30% of Zn by weight, as calculated by: Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 wherein a Zn deposition amount is from 0.08 to 1.28 mg/dm2, a Ni deposition amount is from 0.45 to 3 mg/dm2, and a ratio of a three-dimensional surface area relative to a two-dimensional surface area of the roughened surface is 3 times or more.
地址 Tokyo JP