Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocks

摘要

Disclosed is a stacked chip module incorporating a stack of integrated circuit (IC) chips having integratable and automatically reconfigurable built-in self-maintenance blocks (i.e., built-in self-test (BIST) circuits or built-in self-repair (BISR) circuits). Integration of the built-in self-maintenance blocks between the IC chips in the stack allows for servicing (e.g., self-testing or self-repairing) of functional blocks at the module-level. Automatic reconfiguration of the built-in self-maintenance blocks further allows for functional blocks on any of the IC chips in the stack to be serviced at the module-level even when one or more controllers associated with a given built-in self-maintenance block on a given IC chip has been determined to be defective (e.g., during previous wafer-level servicing). Also disclosed is a method of manufacturing and servicing such a stacked chip module.

主权项

1. A stacked chip module comprising a stack of integrated circuit chips, each of said integrated circuit chips in said stack comprising:
a functional block; a self-maintenance block comprising:
built-in self-maintenance circuitry servicing said functional block, said servicing comprising wafer-level servicing and module-level servicing;a controller electrically connected to said built-in self-maintenance circuitry;reconfiguration circuitry in communication with said controller; and a plurality of interconnect structures electrically connecting said reconfiguration circuitry to adjacent reconfiguration circuitry of at least one adjacent integrated circuit chip in said stack so as to allow said reconfiguration circuitry to automatically and selectively enable one of said controller and another controller on another one of said integrated circuit chips in said stack to control said built-in self-maintenance circuitry during said module-level servicing.