发明名称 MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus with a mold, which allows a mold cleaning step to be eliminated after releasing a product from the mold so as to achieve low cost through shortening of the molding cycle.SOLUTION: The molding apparatus includes: a plurality of pairs of fixed mold 1 and a movable mold 2, which are heated to a temperature required for hardening of molding material and define a cavity C when assembled in mold closing; and an unheated cold runner 32 which supplies the molding material from an injection unit 4 into the cavity C through a gate 22 opening at the movable mold 2. The fixed mold 1 and the movable mold 2 are movable between an injection stage S1 having the injection unit 4 and the cold runner 32 and a mold opening stage S2 adjacent to the injection stage S1.
申请公布号 JP2014188720(A) 申请公布日期 2014.10.06
申请号 JP20130063786 申请日期 2013.03.26
申请人 NOK CORP 发明人 KOGA SHOTARO;URAKAWA TETSUYA;SHINSAKA TAKESHI;KURANO YOSHIHIRO;WATABE SHIGERU;SHIMAZOE TOSHIHIRO
分类号 B29C45/04;B29C33/02;B29C33/34;B29C45/27 主分类号 B29C45/04
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