| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing jig for a semiconductor package capable of flip-chip connecting a semiconductor element to a wiring board in a condition in which the wiring board is being deformed in a predetermined direction.SOLUTION: A manufacturing jig for a semiconductor package includes a lower die 4 containing a bent part 10 which recesses downward and, when a housed wiring board 1 is pressurized, bends along it as well as a threaded hole 8, around the bent part 10, for pressurizing and fixing the upper die 3, an opening part 7, at a center, which allows a semiconductor element 6 to pass, a bent part 10, protruding downward, for pressurizing the wiring board 1 against the lower die 4, and an upper die 3 containing the threaded hole 8 around the bent part 10. |
