发明名称 POLYSTYRENIC RESIN COMPOSITION FOR FOAMING, POLYSTYRENIC RESIN FOAM SHEET, AND FOAM MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polystyrenic resin composition for foaming capable of inhibiting attenuations of mechanical strengths even if the weight thereof is reduced.SOLUTION: The problem-solving polystyrenic resin composition for foaming includes, as constituent components of a matrix resin, a bifunctional vinyl compound and a component derived from a styrenic monomer, whereas the bifunctional vinyl compound has a molecular weight of 100 or higher and lower than 1000, whereas the matrix resin is not only obtained by polymerizing a monomer mixture including 50-1500 ppm of the bifunctional vinyl compound within the styrenic monomer but also includes 50-1500 ppm of an oligomer derived from the styrenic monomer, whereas the matrix resin is a resin exhibiting a ratio of the gradient (a) of the linear approximation line of a non-linear region specific to a logarithmically plotted time-elongational viscosity curve ascertained by measuring the monoaxial elongational viscosity thereof under conditions of temperature=160°C and fixed strain rate=0.1/sec with respect to the gradient (a) of the linear approximation line of a linear region specific to the same curve (a/a) greater than 2.0 and 6.0 or less.
申请公布号 JP2014189767(A) 申请公布日期 2014.10.06
申请号 JP20130069185 申请日期 2013.03.28
申请人 SEKISUI PLASTICS CO LTD 发明人 HIRAI KENJI
分类号 C08J9/12;C08J9/06 主分类号 C08J9/12
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