CURABLE RESIN COMPOSITION, FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE ARTICLE

摘要

A curable resin composition which contains an epoxy compound (A1), active ester compound (A2), filler (A3), and alicyclic olefin polymer (A4) containing groups which have reactivity with respect to epoxy groups, wherein a ratio of content of the alicyclic olefin polymer (A4) to 100 parts by weight of said epoxy compound (A1) is 2 to 50 parts by weight is provided. According to the present invention, a curable resin composition which is excellent in resin fluidity and which can give a cured article which is low in linear expansion and is excellent in wire embedding flatness, electrical characteristics, and heat resistance can be provided.