Electronics Substrate with Enhanced Direct Bonded Metal

摘要

A substrate for electronic components is formed by bonding a cooling metal layer to one side of a ceramic tile and bonding an electronic metal layer to the other side of the electronic tile. The substrate is secured to a machining base and the cooling metal layer surface is enhanced through an MDT process. In the process, fins are sliced into the cooling metal layer with a tool to a depth of less than the cooling metal layer thickness. The slicing forces material upward without removing material from the cooling metal layer, forming fins that extend beyond the original thickness of the cooling metal layer. The fins can be cross-sliced at an angle to form pins.

主权项

1. A method of producing an electronics substrate comprising:
providing a substrate comprised of
a ceramic tile with a cooling metal layer and an electronic metal layer directly bonded to opposite sides of the ceramic tile, andwhere the cooling metal layer has a cooling metal layer thickness; securing the substrate to a machining base such that the electronic metal layer is firmly supported; slicing fins into the cooling metal layer with a tool to form an enhanced surface, where the tool slices into the cooling metal layer to a depth less than the cooling metal layer thickness, and where the slicing step forces sliced material upwards without removing material from the cooling metal layer.