发明名称 LIGHT EMITTING DIODE DEVICE
摘要 A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit.
申请公布号 US2014291706(A1) 申请公布日期 2014.10.02
申请号 US201414308956 申请日期 2014.06.19
申请人 LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ;LITE-ON TECHNOLOGY CORP. 发明人 LIN CHEN-HSIU;CHIU KUO-MING
分类号 H01L33/52;H01L27/15 主分类号 H01L33/52
代理机构 代理人
主权项 1. A light emitting diode (LED) device, comprising: a substrate having a central portion; an LED chip unit formed on said central portion of said substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on said substrate, each of said positive electrode and said negative electrode including an arc portion that extends along said central portion and at least one extending portion that surrounds said arc portion toward said central portion, said extending portion of said positive electrode being opposite to said extending portion of said negative electrode; a wire unit connecting said LED chip unit to said extending portions of said positive electrode and said negative electrode; a glass layer disposed on said substrate, covering said arc portions of said positive electrode and said negative electrode and, including an opening unit that is aligned with said central portion of the substrate; a dam structure formed on said glass layer and extending along said arc portions of said positive electrode and said negative electrode; and an encapsulated body disposed substantially within said dam structure to cover said extending portions of said positive electrode and said negative electrode, said LED chip unit and said wire unit.
地址 JIANGSU PROVINCE CN
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