| 摘要 |
A wafer clamping apparatus according to the present invention comprises: a wafer mounting member in which a wafer is accommodated by mounting; a wafer support member moving upward and downward in the wafer mounting member; a straight line motion force generation member which applies a linear reciprocating motion force; a plate cam member designed to perform a reciprocating circular motion by the straight line motion applied by the straight line motion force generation member; and a clamping member designed to perform a linear reciprocating motion toward the center of the plate cam member by the reciprocating circular motion of the plate cam member. The present invention enables clamping wafers of various sizes while always fixing the center at a particular position, and heating the wafer while clamping. |
