发明名称 Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particle
摘要 There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
申请公布号 US8846142(B2) 申请公布日期 2014.09.30
申请号 US201012982184 申请日期 2010.12.30
申请人 Dexerials Corporation 发明人 Akutsu Yasushi;Namiki Hidetsugu
分类号 B05D5/12;C09J9/02;H05K3/32;H01B1/22;H01R4/04 主分类号 B05D5/12
代理机构 Osha Liang LLP 代理人 Osha Liang LLP
主权项 1. A method for producing a conductive particle comprising: causing fine particles of an insulating resin to collide with the surface of a base particle to cause adhesion of said fine particles to said surface of said base particle to coat said surface with an insulating resin film, wherein the insulating resin of said fine particle is selected from the group consisting of a cross-linked acrylic resin, a styrene-acryl copolymer, a divinylbenzene-acryl copolymer, a styrene-divinylbenzene copolymer, a melamine-formaldehyde copolymer, a silicone-acryl copolymer, a polyamide, a polyimide, polybutadiene and NBR, wherein said surface of said base particle exhibits electrical conductivity, and wherein the insulating resin film comprises: an inner insulating resin layer comprising voids towards the base particle, andan outer shell insulating layer formed continuously and uniformly at an outer surface of the insulating layer by welding of the fine particles.
地址 Tokyo JP