| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder die bonder and a bonding method capable of coping with a work-piece having various allowable thermal histories.SOLUTION: A plurality of work-pieces 5 are supplied in series to a conveyance path 21 through which a work-piece 5 is conveyed, the plurality of work-pieces 5 supplied in series are intermittently sent at a predetermined pitch, a supply device 3 is controlled to form a supply pattern in which the work-piece 5 is not existent in the conveyance path 21, the work-piece 5 on the conveyance path 21 is coated with solder, and a semiconductor element 9 is attached to the work-piece 5 having solder coated thereon. |
