| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a carrier for a double-sided polishing device and a double-sided polishing method for a wafer whereby variation in flatness of a wafer to be polished can be suppressed in a batch.SOLUTION: In a method for manufacturing a carrier for a double-sided polishing device whereby the carrier is manufactured in such a manner that an insert material, which contacts a peripheral edge part of a wafer to be held, is fitted in and bonded to a holding hole for holding the wafer when polishing which is formed in a carry body disposed between upper and lower ruler tables to which polishing clothes in the double-sided polishing device are affixed, the insert material is lapped and polished, then fitted in the holding hole in the carrier body, and while applying a load to the fitted insert material along a direction perpendicular to a principal surface of the carrier body, adhering and drying of the insert material are carried out, whereby the carrier for the double-sided polishing device can be manufactured. |
