| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder die bond, a bonding method, and a device for determining a drive method of the solder die bond, in which throughput is improved in a work-piece having various thermal histories.SOLUTION: Disclosed are a solder die bonder, a bonding method, and a device for determining a drive method of a die bonder which determines the drive method, in which a plurality of work-pieces are supplied in series onto a conveyance path through which the work-piece is conveyed at a predetermined interval, the plurality of work-pieces supplied in series are intermittently sent at a determined pitch, and a semiconductor element is attached to the work-pieces. Based on a supply pattern which supplies the work-pieces onto the conveyance path, allowable thermal histories of the work-pieces, and a plurality of heating temperatures for the work-pieces, the drive method is determined. |
