| 发明名称 |
ENCAPSULATION PROCESS AND ASSOCIATED DEVICE |
| 摘要 |
The invention relates to an encapsulation process for an electronic component (2). The component (2) is connected to an electrical contact track composed of a metal layer (101).;The process according to the invention comprises the following steps:
deposition of a titanium nitride layer (102) directly on at least part of the electrical contact track (101); anddeposition of an aluminium oxide layer (4) by atomic layer deposition, such that the encapsulation layer (4) directly covers the titanium nitride layer (102).;The process according to the invention enables electrical contact through the encapsulation layer (4).;The invention also relates to an electronic device obtained using such a process. |
| 申请公布号 |
US2014284807(A1) |
申请公布日期 |
2014.09.25 |
| 申请号 |
US201414217670 |
申请日期 |
2014.03.18 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT |
发明人 |
Maindron Tony;Troc Nicolas |
| 分类号 |
H01L21/56;H01L51/52;H01L51/44;H01L29/66;H01L31/18;H01L31/0203;H01L29/786;H01L51/56;H01L51/00 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An encapsulation process for at least one electronic component, said component being connected to at least one electrical contact track composed of a metal layer, the process comprising:
depositing an aluminium oxide encapsulation layer by atomic layer deposition,
depositing a titanium nitride layer directly on at least part of the electrical contact track; and depositing the encapsulation layer such that said encapsulation layer directly covers the titanium nitride layer. |
| 地址 |
Paris FR |
