| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board capable of obtaining a printed wiring board with high conduction reliability between a first wiring and a second wiring to thermal shock.SOLUTION: A method for manufacturing a printed wiring board 1 comprises the steps of: forming a first insulating layer 13 having a hole 13a opened so that a surface 12a of a first wiring 12 is partly exposed on a surface of the first wiring 12 on a substrate 11 or a surface of a second insulating layer using a laminate in which the first wiring 12 is arranged; performing desmear processing in the hole 13a of the first insulating layer 13; roughening the surface 12a of the first wiring 12 exposed from the opening of the hole 13a after the desmear processing; and forming a second wiring 14 on a surface of the first insulating layer 13 and in the hole 13a of the first insulating layer 13. The surface 12a of the first wiring 12 roughed after the desmear processing is connected to a surface of the second wiring 14. |
