METHOD AND APPARATUS FOR PROTECTING SUBSTRATE DURING PROCESSING USING PARTICLE BEAM

摘要

PROBLEM TO BE SOLVED: To provide a method and apparatus for protecting a substrate during a processing using particle beam.SOLUTION: This invention relates to a method and apparatus for protecting a substrate during a processing using at least one particle beam. The method comprises steps of: (a) applying a locally restricted limited protection layer on the substrate; (b) etching the substrate and/or a layer arranged on the substrate by using at least one particle beam and at least one gas; and/or (c) depositing material onto the substrate by using at least one particle beam and at least one precursor gas; and (d) removing the locally limited protection layer from the substrate.