| 发明名称 |
DEVICE WITH INTEGRATED PASSIVE COMPONENT |
| 摘要 |
Semiconductor devices and methods for forming a semiconductor device are presented. The semiconductor device includes a die which includes a die substrate having first and second major surfaces. The semiconductor device includes a passive component disposed below the second major surface of the die substrate. The passive component is electrically coupled to the die through through silicon via (TSV) contacts. |
| 申请公布号 |
US2014264733(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313802835 |
申请日期 |
2013.03.14 |
| 申请人 |
GLOBALFOUNDERIES SINGAPORE PTE. LTD. |
发明人 |
YUAN Shaoning;LU Yue Kang;LIM Yeow Kheng;TAN Juan Boon;SIAH Soh Yun |
| 分类号 |
H01L49/02;H01L21/768 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a die which includes a die substrate having first and second major surfaces; and a passive component disposed below the second major surface of the die substrate, wherein the passive component is electrically coupled to the die through through silicon via (TSV) contacts. |
| 地址 |
Singapore SG |
