| 摘要 |
PROBLEM TO BE SOLVED: To provide a device capable of: inspecting electrical characteristics of a chip electronic component by contacting each electrode layer of the chip electronic component housed in a chip electronic component holding plate including many through-holes and having electrode layers on both end surfaces faced to each other with an electrode terminal to classify the measured chip electronic component on the basis of the inspection result; and suppressing occurrence of a contact scratch on an electrode layer surface of the chip electronic component due to contact with the electrode terminal for electric characteristic inspection.SOLUTION: As the electrode terminal contacted with a chip electronic component, used are an electrode terminal constituted by bundling conductive fibers having a Young's modulus of 18000 kg/mmor less so as to be superimposed in each of two dimensional directions, or an electrode terminal constituted by bundling conductive amorphous alloy material fibers so as to be superimposed in each of two dimensional directions. |
