发明名称 |
PROCESSES FOR IMPROVING FORMABILITY OF WROUGHT COPPER-NICKEL-TIN ALLOYS |
摘要 |
Disclosed are processes for improving the formability of a copper-nickel-tin alloy having a 0.2% offset yield strength that is above 115 ksi. The alloy includes about 14.5 to about 15.5 wt % nickel, about 7.5 to about 8.5 wt % tin, and the remaining balance is copper. The copper-nickel-tin alloy is mechanically cold worked to undergo between 5% and 15% plastic deformation. The alloy is then heat treated at elevated temperatures of about 450° F. to about 550° F. for a period of about 3 hours to about 5 hours. The alloy is then subsequently mechanically cold worked again to undergo between 4% and 12% plastic deformation. The alloy is then further heated to an elevated temperature of about 700° F. to about 850° F. for a period between about 3 minutes and about 12 minutes to relieve stress. The resulting alloy has a combination of good formability ratio and good yield strength. |
申请公布号 |
US2014261924(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201414204489 |
申请日期 |
2014.03.11 |
申请人 |
Materion Corporation |
发明人 |
Wetzel John F.;Skoraszewski Ted |
分类号 |
C22F1/08 |
主分类号 |
C22F1/08 |
代理机构 |
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代理人 |
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主权项 |
1. A process for improving the formability of a wrought copper-nickel-tin alloy having a 0.2% offset yield strength that is at least 115 ksi, comprising:
performing a first mechanical cold working step on a copper-nickel-tin alloy to a percentage of cold working (% CW) of about 5% to about 15%; and relieving stress in the alloy through a heat treatment step. |
地址 |
Mayfield Heights OH US |