| 摘要 |
<p>A system based on electroadhesion facilitates high-volume assembly of objects including micron sized objects. An assembler component of the system includes a grid of electrically controlled elements that induce charge on the object. The system accurately picks up and places objects including in parallel. The invention relates generally to pick and place system and methods in which objects are picked from one location, transferred to another location, and placed in a precise position. More specifically, the invention relates to system and methods for object manipulation that utilizes electroadhesion in order to easily, carefully, and quickly pick and place objects, including micron sized objects, with precision.</p> |
