| 摘要 |
A method for bonding a substrate of the present invention comprises the steps of: applying an adhesive solution to one side of a first substrate; contacting the adhesive solution applied on the side of the first substrate to a surface of a second substrate; applying the adhesive solution to the entire one side of the first substrate and the entire surface of the second substrate with a surface tension of the adhesive solution as at least one of the first substrate, and the second substrate moves to the horizontal and vertical directions in the state that the adhesive solution is in contact with the surface of the second substrate; and bonding the first substrate and the second substrate by hardening the adhesive solution. [Reference numerals] (500) Upper stage; (600) Lower stage |
