发明名称 |
Semiconductor device comprising self-aligned contact elements |
摘要 |
When forming sophisticated semiconductor devices, a replacement gate approach may be applied in combination with a self-aligned contact regime by forming the self-aligned contacts prior to replacing the placeholder material of the gate electrode structures. |
申请公布号 |
US8835245(B2) |
申请公布日期 |
2014.09.16 |
申请号 |
US201213372604 |
申请日期 |
2012.02.14 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Baars Peter;Schloesser Till;Jakubowski Frank;Wei Andy;Carter Richard;Schaller Matthias |
分类号 |
H01L21/8234;H01L21/768;H01L21/285;H01L29/66;H01L29/78 |
主分类号 |
H01L21/8234 |
代理机构 |
Amerson Law Firm, PLLC |
代理人 |
Amerson Law Firm, PLLC |
主权项 |
1. A method, comprising:
forming a contact element laterally adjacent to a gate electrode structure so as to connect to one of a drain region and source region formed in an active region of a semiconductor device, said gate electrode structure comprising a placeholder electrode material covered by a dielectric cap layer; wherein forming said contact element comprises: forming a dielectric material above said drain and source regions and laterally adjacent to said gate electrode structure; forming a contact opening in said dielectric material so as to expose at least a portion of said one of a drain region and a source region; forming a sacrificial fill material in said contact opening; performing a common removal process to remove said dielectric cap layer and a portion of said sacrificial fill material so as to expose a surface of said placeholder material; and replacing said placeholder electrode material at least with a metal-containing electrode material in the presence of said contact element. |
地址 |
Grand Cayman KY |