DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING, METHOD FOR LOW-TEMPERATURE PRESSURE SINTERING AND POWER ELECTRONICS ASSEMBLY

摘要

The invention relates to a device for the low-temperature pressure sintering of electric components (8) on a substrate (6), said device having a heatable upper die (1, 2, 3) and a heatable lower die. The device is characterised in that the upper die (1, 2, 3) and the lower die each have at least one pressure pad (4).