| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink, having excellent heat dissipation characteristics and capable of preventing the occurrence of cracks or the like by reducing warp due to thermal expansion and contraction.SOLUTION: In a substrate 10A for a power module with a heat sink, the thickness of a circuit layer 12 is set to be 1.5 mm or more and 5.0 mm or less, the thickness of a metal layer 13 is set to be 0.4 mm or more and 2.1 mm or less, and a recessed groove 15 is formed along an end part 14a located at least on the shorter side of a ceramic substrate 11, on a surface 14 opposite to a bonding surface with the ceramic substrate 11 of the circuit layer 12. The recessed groove 15 is formed at a location apart from the end part 14a by equal to or more than (0.18 t+1.01) mm and equal to or less than (0.18 t+2.01) mm when the thickness of the circuit layer 12 is t mm. |
