| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device which can avoid a knife edge and obtain a stable and tough wafer laminate, and in addition, which can increase the number of semiconductor chips taken from one wafer.SOLUTION: A method for manufacturing a semiconductor device according to an embodiment comprises: forming a laminate by sticking a first wafer and a second wafer; rubbing a film to which a fill material is attached in a thin film shape on a gap located between a bevel of the first wafer and a bevel of the second wafer along a circumference of the laminate to bury the fill material into the gap; and thinning the first wafer.</p> |
