| 发明名称 | Light emitting device package | ||
| 摘要 | Provided is a light emitting device package. The light emitting device package comprises a body formed of a silicon-based material; an insulating layer having a first opening on a surface of the body; a first and second metal layers disposed on the insulating layer; a light emitting device having a plurality of compound semiconductor layers disposed on a top surface of the body and connected to the first and second metal layers; and a protection device disposed on the body and electrically connected to the light emitting device, wherein the insulating layer has a second opening on a bottom surface of the body, wherein a first portion of the first metal layer is connected to the protective device and is disposed in the second opening of the insulating layer. | ||
| 申请公布号 | US8829538(B2) | 申请公布日期 | 2014.09.09 |
| 申请号 | US201313794140 | 申请日期 | 2013.03.11 |
| 申请人 | LG Innotek Co., Ltd. | 发明人 | Cho Bum Chul |
| 分类号 | H01L27/15 | 主分类号 | H01L27/15 |
| 代理机构 | Birch, Stewart, Kolasch & Birch, LLP | 代理人 | Birch, Stewart, Kolasch & Birch, LLP |
| 主权项 | 1. A light emitting device package comprising: a body formed of a silicon-based material; an insulating layer having a first opening on a surface of the body; a first and second metal layers disposed on the insulating layer; a light emitting device having a plurality of compound semiconductor layers disposed on a top surface of the body and connected to the first and second metal layers; and a protection device disposed on the body and electrically connected to at least one of the light emitting device and the body, wherein the insulating layer has a second opening on the body, wherein a first portion of the first metal layer is connected to the protective device and is disposed in the second opening of the insulating layer, wherein the light emitting device is directly contacted with the top surface of the body. | ||
| 地址 | Seoul KR | ||