发明名称 SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method which efficiently separates a support medium and a substrate from a lamination body.SOLUTION: A substrate processing method according to the invention includes: a cooling step where a lamination body 1 formed by laminating a substrate 11, an adhesive layer 13, and a support plate 12 in this order is cooled; and a support medium separation step where the support plate 12 is separated from the cooled lamination body 1 after the cooling step.
申请公布号 JP2014165400(A) 申请公布日期 2014.09.08
申请号 JP20130036395 申请日期 2013.02.26
申请人 TOKYO OHKA KOGYO CO LTD 发明人 YOSHIOKA TAKAHIRO;IMAI HIROFUMI;KUBO ATSUSHI
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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