BONDING APPARATUS AND METHOD FOR CONTROLLING SAME

摘要

Provided is a low-cost and small bonding apparatus which can efficiently align and bond works by using a turntable.  A method for controlling the bonding apparatus is also provided.  The bonding apparatus which bonds a pair of works (S1, S2) is provided with: a turntable (1) which intermittently rotates corresponding to a plurality of positions; a plurality of holding apparatuses (2) which are provided on the turntable (1) and hold the works (S1, S2); an aligning section (300) which is provided on the holding apparatuses (2) and aligns the work (S1); and a pressing apparatus (5) which bonds the work (S2) on the work (S1) by urging the work (S2) held by the holding apparatus (2).  A driving section (400) which drives the aligning section (300) is provided independently from the turntable (1) and removably from the aligning section (300).