发明名称 THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, OPTICAL SEMICONDUCTOR MOUNTING SUBSTRATE USING THE SAME, METHOD OF MANUFACTURING THE OPTICAL SEMICONDUCTOR MOUNTING SUBSTRATE, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection having a high reflective index from visible light to near-ultraviolet light after hardening, and to provide an optical semiconductor mounting substrate using the same and a method of manufacturing the optical semiconductor mounting substrate.SOLUTION: In a thermosetting resin composition for light reflection containing (A) epoxy resin, (B)a hardener, (C) a hardening catalyst, (D) an inorganic filler, (E) a white pigment, and (F) a coupling agent, an optical reflective index at a wavelength of 800-350 nm after thermal hardening is 80% or more, and pressure molding at an ambient temperature (25°C) is possible before thermal hardening.
申请公布号 JP2014159600(A) 申请公布日期 2014.09.04
申请号 JP20140108112 申请日期 2014.05.26
申请人 HITACHI CHEMICAL CO LTD 发明人 URASAKI NAOYUKI
分类号 C08L63/00;C08G59/18;C08K3/22;C08K3/26;C08K3/30;C08K3/36;C08K7/24;H01L33/60 主分类号 C08L63/00
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