| 摘要 |
<p>The present invention relates to an LED heat dissipating substrate and a manufacturing method thereof. According to the present invention, a conductive layer made of a conductive material, and a non-conductive layer made of an insulating material are alternately laminated; then a laminated structure is sliced. Thereby, the planar heat dissipating substrate, on which the conductive zone and the non-conductive zone are alternately formed, is manufactured. LED devices are directly arranged on the conductive zone. Therefore, the composition of a circuit is simplified and at the same time, efficiency of heat dissipation can be maximized.</p> |
