发明名称 MOLDING DEVICE AND MOLDING METHOD BY THE MOLDING DEVICE
摘要 A molding device which can heat molding portions of dies by a simple structure while guaranteeing the durability of the molding portions of the dies, and a method of molding a product using the molding device are provided. A molding device 100 includes a first die 110 and a second die 120 for molding a product PR to be molded. The first die 110 and the second die 120 have a first molding portion 111 and a second molding portion 121 formed at central portions of the surfaces which face each other. Each of the first molding portion 111 and the second molding portion 121 has a three-dimensional shape corresponding to the surface shape of the product PR. Thermal/electrical insulators 113 and 124 are provided around the first molding portion 111 and the second molding portion 121 of the first die 110 and the second die 120. An electrical power supply apparatus 136 is connected to the first die 110 and the second die 120 through input/output electrodes 132 and 133, and the first die 110 and the second die 120 can be electrically connected together through connection electrodes 134 and 135 and electrically disconnected from each other.
申请公布号 EP2656992(A4) 申请公布日期 2014.09.03
申请号 EP20110851450 申请日期 2011.12.21
申请人 CAP CO. LTD 发明人 TAKAI MITSUO
分类号 B29C33/02 主分类号 B29C33/02
代理机构 代理人
主权项
地址