Method of manufacturing a SiC bipolar junction transistor and SiC bipolar junction transistor thereof

摘要

A method of manufacturing a silicon carbide (SiC) bipolar junction transistor (BJT) and a SiC BJT are provided. The SiC BJT comprises an emitter region, a base region and a collector region. The collector region is arranged on a substrate having an off-axis orientation of about 4 degrees or lower. Further, a defect termination layer (DTL) is arranged between the substrate and the collector region. A thickness and a doping level of the DTL are configured to terminate basal plane dislocations in the DTL and reduce the growth of defects from the DTL to the collector region. At least some of the embodiments are advantageous in that SiC BJTs with improved stability are provided. Further, a method of evaluating the degradation performance of a SiC BJT is provided.

主权项

1. A method of manufacturing a silicon carbide (SiC) bipolar junction transistor, comprising:
forming a collector region on a substrate having an off-axis orientation less than or equal to 4 degrees; forming a defect termination layer (DTL) disposed between the substrate and the collector region; and adjusting a thickness and a doping level of the DTL.