发明名称 ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
摘要 Provided herein are electronic devices assembled with thermally insulating layers.
申请公布号 US2014239480(A1) 申请公布日期 2014.08.28
申请号 US201414267552 申请日期 2014.05.01
申请人 Henkel lP & Holding GmbH 发明人 Nguyen My Nhu;Brandi Jason
分类号 H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项 1. A consumer electronic article of manufacture comprising: A housing comprising at least one substrate having an interior surface and an exterior surface; A layer of thermally insulating elements disposed on at least a portion of the interior surface of the at least one substrate; and At least one semiconductor package comprising an assembly comprising at least one ofI. a semiconductor chip; a heat spreader; and a thermal interface material therebetween, orII. a heat spreader; a heat sink; and a thermal interface material therebetween.
地址 Duesseldorf DE