发明名称 |
ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS |
摘要 |
Provided herein are electronic devices assembled with thermally insulating layers. |
申请公布号 |
US2014239480(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
US201414267552 |
申请日期 |
2014.05.01 |
申请人 |
Henkel lP & Holding GmbH |
发明人 |
Nguyen My Nhu;Brandi Jason |
分类号 |
H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
|
代理人 |
|
主权项 |
1. A consumer electronic article of manufacture comprising:
A housing comprising at least one substrate having an interior surface and an exterior surface; A layer of thermally insulating elements disposed on at least a portion of the interior surface of the at least one substrate; and At least one semiconductor package comprising an assembly comprising at least one ofI.
a semiconductor chip; a heat spreader; and a thermal interface material therebetween, orII.
a heat spreader; a heat sink; and a thermal interface material therebetween. |
地址 |
Duesseldorf DE |