SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which improves an etching rate and inhibits the deterioration of an etching selection ratio. ! SOLUTION: A substrate processing apparatus includes: a phosphoric acid supply device which supplies a phosphoric acid solution to an upper surface of a substrate W held by a spin chuck 5 thereby forming a liquid film of the phosphoric acid solution which covers the entire upper surface of the substrate W; a covering member 62 which is disposed along the liquid film of the phosphoric acid solution and covers the upper surface of the substrate W with a covering surface 66 larger than the substrate W in a plane view through the liquid film of the phosphoric acid solution; a heater 10 which heats the substrate W in a state that the liquid film of the phosphoric acid solution is held on the substrate W; and a pure water supply device 36 which supplies pure water to the liquid film of the phosphoric acid solution. ! COPYRIGHT: (C)2014,JPO&INPIT