发明名称 COMPONENT MOUNTING DEVICE, AND COMPONENT MOUNTING METHOD
摘要 <p>Provided is component mounting method which includes: a transfer step in which a suction nozzle (37A) is used to transfer a shielding lid component (15) to a shielding frame component (16) of a substrate (3), and the shielding lid component (15) is pressed at a first load (F1); and a pressing step in which the shielding lid component (15) is fitted to the shielding frame component (16) by being pressed at a second load (F2) which is greater than the first load (F1). In the transfer step, the shielding lid component (15) is held by applying suction in the vicinity of a central portion of an upper surface of the shielding lid component (15). In the pressing step, a region to be pressed set in accordance with the shielding frame component (16) is pressed.</p>
申请公布号 WO2014129194(A1) 申请公布日期 2014.08.28
申请号 WO2014JP00886 申请日期 2014.02.20
申请人 PANASONIC CORPORATION 发明人 YAMAMOTO, SHINJI;FUJIWARA, HIROYUKI
分类号 H05K13/04;H05K9/00 主分类号 H05K13/04
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