Packaging and connecting electrostatic transducer arrays

摘要

Embodiments of a method for packaging cMUT arrays allow packaging multiple cMUT arrays on the same packaging substrate introduced over a side of the cMUT arrays. The packaging substrate is a dielectric layer on which openings are patterned for depositing a conductive layer to connect a cMUT array to VO pads interfacing with external devices. Auxiliary system components may be packaged together with the cMUT arrays. Multiple cMUT arrays and optionally multiple auxiliary system components can be held in place by a larger support structure for batch production. The support structure can be made of an arbitrary size using inexpensive materials.

主权项

1. A method for packaging a capacitive micromachined ultrasonic transducer (cMUT) array, the method comprising:
fabricating the cMUT array on a cMUT fabrication substrate; introducing a first dielectric packaging substrate layer over the cMUT array and the cMUT fabrication substrate; forming a first pattern in the first dielectric packaging substrate layer, the first pattern having a first opening over the cMUT array; introducing a first conductive layer patterned over the first dielectric packaging substrate layer to provide at least a first part of an interconnection for connecting the cMUT array to outside through the first opening; and removing a portion of the cMUT fabrication substrate.