发明名称 |
GRINDING DEVICE, AND METHOD OF REPLACING GRINDING PAD |
摘要 |
PROBLEM TO BE SOLVED: To materialize the accurate replacement of a grinding pad in which an influence on grinding performance of a substrate is suppressed.SOLUTION: A grinding device comprises: a grinding table 110 on which a grinding pad 108 for grinding a substrate is pasted; and a control portion 140 pressurizing or decompressing a back surface 108b of the grinding pad 108 pasted to the grinding table 110. The control portion 140 injects a fluid through a hole 111 formed on the grinding table 110 in a peeling step for peeling the grinding pad 108 from the grinding table 110, thereby pressurizing the back surface 108b of the grinding pad. The control portion 140 injects or sucks the fluid through the hole 111 in a pasting step for pasting the grinding pad 108 to the grinding table 110, thereby pressurizing or decompressing the back surface 108b of the grinding pad. |
申请公布号 |
JP2014147985(A) |
申请公布日期 |
2014.08.21 |
申请号 |
JP20130016876 |
申请日期 |
2013.01.31 |
申请人 |
EBARA CORP |
发明人 |
HIRAI EIJI;SAKURAI TAKESHI |
分类号 |
B24B37/20;B24B37/12;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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