发明名称 |
METHOD FOR DEPOSITING A FIRST METALLIC LAYER ONTO NON-CONDUCTIVE POLYMERS |
摘要 |
The present invention relates to the etching, activation and deposition of a first metal or metal alloy layer onto non-conductive polymers. The non-conductive polymer is etched with an aqueous solution comprising 0.75 to 3.6 g/l permanganate ions in 60 to 80 vol.-% sulfuric acid, activating with a solution comprising a noble metal and depositing a first metal or metal alloy by immersion-type or electroless (autocatalytic) plating. The first metal or metal alloy layer obtained has a high adhesion on the non-conductive polymer and serves as a plating base for electroplating further metal and/or metal alloy layer(s) thereon. |
申请公布号 |
WO2014124773(A2) |
申请公布日期 |
2014.08.21 |
申请号 |
WO2014EP50657 |
申请日期 |
2014.01.15 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
NARUSKEVICIUS, LEONAS;BARANAUSKAS, MYKOLAS;TAMASAUSKAITE TAMASIUNAITE, LORETA;GYLIENE, ONA |
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