发明名称 Device structures compatible with fin-type field-effect transistor technologies
摘要 Device structures, design structures, and fabrication methods for fin-type field-effect transistor integrated circuit technologies. First and second fins, which constitute electrodes of the device structure, are each comprised of a first semiconductor material. The second fin is formed adjacent to the first fin to define a gap separating the first and second fins. Positioned in the gap is a layer comprised of a second semiconductor material.
申请公布号 US8809967(B2) 申请公布日期 2014.08.19
申请号 US201414191626 申请日期 2014.02.27
申请人 International Business Machines Corporation 发明人 Gauthier, Jr. Robert J.;Johnson Jeffrey B.;Li Junjun
分类号 H01L27/088;H01L27/12 主分类号 H01L27/088
代理机构 Wood, Herron & Evans LLP 代理人 Wood, Herron & Evans LLP ;Canale Anthony J.
主权项 1. A device structure comprising: a first fin comprised of a first semiconductor material; a second fin comprised of the first semiconductor material, the second fin adjacent to the first fin to define a gap separating the first fin from the second fin; and a first layer comprised of a second semiconductor material, the first layer positioned in the gap between the first fin and the second fin, wherein the first fin is a first electrode of the device structure and the second fin is a second electrode of the device structure.
地址 Armonk NY US