发明名称 |
Device structures compatible with fin-type field-effect transistor technologies |
摘要 |
Device structures, design structures, and fabrication methods for fin-type field-effect transistor integrated circuit technologies. First and second fins, which constitute electrodes of the device structure, are each comprised of a first semiconductor material. The second fin is formed adjacent to the first fin to define a gap separating the first and second fins. Positioned in the gap is a layer comprised of a second semiconductor material. |
申请公布号 |
US8809967(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US201414191626 |
申请日期 |
2014.02.27 |
申请人 |
International Business Machines Corporation |
发明人 |
Gauthier, Jr. Robert J.;Johnson Jeffrey B.;Li Junjun |
分类号 |
H01L27/088;H01L27/12 |
主分类号 |
H01L27/088 |
代理机构 |
Wood, Herron & Evans LLP |
代理人 |
Wood, Herron & Evans LLP ;Canale Anthony J. |
主权项 |
1. A device structure comprising:
a first fin comprised of a first semiconductor material; a second fin comprised of the first semiconductor material, the second fin adjacent to the first fin to define a gap separating the first fin from the second fin; and a first layer comprised of a second semiconductor material, the first layer positioned in the gap between the first fin and the second fin, wherein the first fin is a first electrode of the device structure and the second fin is a second electrode of the device structure. |
地址 |
Armonk NY US |