发明名称 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要 A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device.
申请公布号 US2014225139(A1) 申请公布日期 2014.08.14
申请号 US201314079249 申请日期 2013.11.13
申请人 Samsung Electronics Co., Ltd. 发明人 PARK Myoung Bo;SONG Ho Young
分类号 H01L33/62;H01L33/52;H01L33/60;H01L33/50 主分类号 H01L33/62
代理机构 代理人
主权项 1. A light emitting device package comprising: a frame unit comprising at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the lead frames; a light emitting device that is mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and that is electrically connected to the lead frames; a wavelength conversion unit configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength externally; and a reflective molding unit that is formed on the surface of the frame unit to cover the light emitting device.
地址 Suwon-si KR