发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device. |
申请公布号 |
US2014225139(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201314079249 |
申请日期 |
2013.11.13 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
PARK Myoung Bo;SONG Ho Young |
分类号 |
H01L33/62;H01L33/52;H01L33/60;H01L33/50 |
主分类号 |
H01L33/62 |
代理机构 |
|
代理人 |
|
主权项 |
1. A light emitting device package comprising:
a frame unit comprising at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the lead frames; a light emitting device that is mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and that is electrically connected to the lead frames; a wavelength conversion unit configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength externally; and a reflective molding unit that is formed on the surface of the frame unit to cover the light emitting device. |
地址 |
Suwon-si KR |