A heat sink (10) includes a frame (12) having a non-metallic body (16) that includes a window (58). The non-metallic body includes at least one peripheral wall (52) that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger (14) having a base (18) and cooling fins (20). The base has a structure side (34) and an opposite environmental side (36). The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
申请公布号
WO2014123774(A1)
申请公布日期
2014.08.14
申请号
WO2014US14077
申请日期
2014.01.31
申请人
TYCO ELECTRONICS CORPORATION
发明人
YI, CHONG HUN;BALTHASER, ANDREW DEWITT;KLINGER, BRIAN TODD;MCALONIS, MATTHEW RICHARD;MILLER, KEITH EDWIN