| 摘要 |
PROBLEM TO BE SOLVED: To achieve prevention against short-circuiting and prevention against lead falling during mounting of a semiconductor device.SOLUTION: A semiconductor device comprises: a tab 5 which supports a semiconductor chip 8; a sealing part 12 formed by sealing the semiconductor chip 8 with a resin; a tab suspension lead 4 which supports the tab 5; a plurality of leads 2 which each include a connected part exposed at a peripheral edge of a reverse surface of the sealing part 12 and a thin part formed at a tab-side end thinner than the connected part, an inner groove part 2e and an outer groove part 2f being provided on a wire joint surface 2d, arranged in the sealing part 12, of the connected part; and a wire 10 which connects a pad 7 of the semiconductor chip 8 and the leads 2 to each other. Thin parts of the leads 2 are covered with a sealing resin, the wire 10 is joined to the connected parts between the outer groove parts 2f and inner groove parts 2e, and the thin parts, outer groove parts 2f, and inner groove parts 2e of the leads 2 prevent the leads from falling. |
