发明名称 |
ELECTROLYSIS COPPER ALLOY FOIL AND ELECTROLYSIS COPPER ALLOY FOIL WITH CARRIER FOIL |
摘要 |
An object of the present invention is to provide an electro-deposited copper-alloy foil excellent in infrared laser processability which enables uniform etching rate along a thickness direction in following etching process. To achieve the object, an electro-deposited copper-alloy foil obtained from electrolyzing of an electrolytic solution, wherein the electro-deposited copper-alloy foil has tin content of 8% by mass to 25% by mass is employed. In the electro-deposited copper-alloy foil, a grain in a crystal structure is preferably a columnar grain longitudinal along a thickness direction. |
申请公布号 |
KR20140097208(A) |
申请公布日期 |
2014.08.06 |
申请号 |
KR20147013943 |
申请日期 |
2012.11.30 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MATSUDA MITSUYOSHI;YOSHIKAWA KAZUHIRO;FUJIMOTO TAKAO |
分类号 |
C25D3/58;C25D5/48 |
主分类号 |
C25D3/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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