Electronic component and producing method thereof

摘要

A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.

主权项

1. A method for producing an electronic component, the electronic component including a component body and an external electrode formed on a particular region in a surface of the component body, the electronic component producing method comprising:
a step of preparing the component body in which a bump is provided in a position, the particular region where the external electrode should be formed being partitioned at the position; and a plating step of directly plating the surface of the component body to deposit a plating film in the particular region, the plating film constituting the external electrode; wherein the plating step includes a step of growing the plating film toward the bump and a step of substantially stopping or delaying the growth of the plating film in the bump.