| 发明名称 |
Stacked semiconductor chip device with thermal management circuit board |
| 摘要 |
A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip. |
| 申请公布号 |
US8796842(B2) |
申请公布日期 |
2014.08.05 |
| 申请号 |
US201012860244 |
申请日期 |
2010.08.20 |
| 申请人 |
ATI Technologies ULC;Advanced Micro Devices, Inc. |
发明人 |
Refai-Ahmed Gamal;Su Michael Z.;Black Bryan |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
Honeycutt Timothy M. |
| 主权项 |
1. A method of assembling a semiconductor chip device, comprising:
providing a circuit board including a first side and a second side opposite to the first side, the second side having an aperture that does not extend to the first side; positioning a first heat spreader on the second side, the first heat spreader including a first portion in the aperture and with a surface facing away from the aperture, and a second portion including at least one projection extending beyond the aperture and adapted to thermally contact a second heat spreader; and positioning a stack on the second side, the stack including a first semiconductor chip positioned on the surface of the first heat spreader and a substrate having a first side coupled to the first semiconductor chip. |
| 地址 |
Markham CA |
