| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of forming a plurality of desired dimples in a short cycle time.SOLUTION: A method of manufacturing a semiconductor device includes following steps of: (a) emitting laser light 21a from a laser oscillator 21; (b) branching the laser light 21a into a plurality of optical paths axial symmetrical about an optical axis of the laser light 21a, by using a beam splitter 22; and (c) guiding the laser light 21a branched into the plurality of optical paths while maintaining the axial symmetry by using a lens 23 and a movable lens 24, condensing it onto a surface of the heat sink 13, and forming a plurality of dimples 18 on the surface by using an interference pattern generated by the light condensation. |
