PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a sufficient effect on improvement in resolution and resist stripping characteristics.SOLUTION: The photosensitive resin composition comprises: (A) a binder polymer having a structural unit based on styrene or a styrene derivative, a structural unit based on a (meth)acrylic acid benzyl or a (meth)acrylic acid benzyl derivative, a structural unit based on a (meth)acrylic acid, and a structural unit based on a (meth)acrylic acid alkyl ester, and having a dispersion degree of 1.0 to 2.0; (B) a photopolymerizable compound; and (C) a photopolymerization initiator. The (A) binder polymer further includes at least one of a structural unit based on a (meth)acrylic acid 2-ethylhexyl ester and a structural unit based on a (meth)acrylic acid dodecyl ester.