MODULE AND METHOD FOR PRODUCING SAME

摘要

The purpose of the present invention is to provide a module which is capable of improving the connection reliability between a wiring board and an electronic component that is mounted on the wiring board. A module (1) is provided with: a wiring board (2); an electronic component (3) that is mounted on one main surface of the wiring board (2); an underfill resin layer (4) that is formed on all over the surface of the one main surface of the wiring board (2) so as to fill up the gap between the one main surface of the wiring board (2) and the electronic component (3); and a mold resin layer (5) that is formed so as to cover the underfill resin layer (4) and the electronic component (3). The underfill resin layer (4) is formed of a resin which contains a filler having a particle diameter that is smaller than the distance between the one main surface of the wiring board (2) and the electronic component (3).