| 摘要 |
The present invention provides a power semiconductor module (1) which has a substrate (2) and a power semiconductor component (13) disposed on the substrate (2) and connected to the substrate (2). The module (1) has a conductive connecting device (9) implemented with a single piece. The conductive connecting device (9) has flat first and second connection regions (19 and 20) and an elastic region (15) arranged between the first and second connection regions (19 and 20). The elastic region (15) has strip-shaped first and second mold elements (17, 18) that are alternately arranged with each other while the first and second mold elements (17, 18) are bent about each other. The first connection region (19) is connected to the substrate (2). In addition the present invention relates to a method of manufacturing the power semiconductor module (1). The present invention provides a reliable a power semiconductor module (1) and is characterized in the method of manufacturing the power semiconductor module (1). |
